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FLEXIBLE PCB PRODUCTION TECHNICAL CHARACTERISTICS

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Asik Elektronik detailed information on flexible PCB production technical characteristics. Below is the chart technical capacity.

Processing and parameterize details used during manufacturing flexible PCB.

Process

Parameter
  • Polyimde Film 
  • 0.5 mil, 1 mil, 1.5 mils, 2 mils
  • Material
  • Polyimide / Polyester
  • Copper Foils Thickness
  • 18 – 70 µCu
  • Plating
  • Tin – unleaded, Nickel, Gold
  • Tape Fittings 
  • Pressure Sensetive Adhesive (PSA)
  • Number of Layers 
  • 1 – 2
  • Minimum Trace and Space 
  • 3 mil & 3 mil (1 oz copper)
  • Smallest Drill Size 
  • 0.2 mm
  • Min. Annular Ring Widht
  • 4 mils
  • Total Thickness of Part 
  • 45 – 300 µCu
  • PTH Wall Copper Thickness
  • 0.025 mm
  • Flexibility
  • R=7, 180° , No broken crease (single panel) at time bending
  • Hole Dia. Tolerance (PTH)
  • +/- 0.05 mm
  • Hole Dia. Tolerance (NPTH)
  • +/- 0.08 mm
  • Outline Tolerance
  • +/- 0.1 mm